Advanced Materials Meet Smart Device Challenges
The rise of AI models is driving a new generation of high-performance laptops. Addressing thermal management and weight reduction challenges, Covestro's Desmopan® XHR series TPU offers exceptional thermal wear resistance for heat-exposed components such as foot pads. In a breakthrough innovation, Covestro pioneered a single-material design approach, using high-hardness TPU to replace conventional PC/ABS in laptop bottom covers while integrating seamlessly with TPU foam foot pads. This advancement enhances component integration while improving product lightweighting and recyclability.
"Taiwan stands as a global hub for laptop and semiconductor industries," says Alec Yang, Head of Sales and Market Development Taiwan of Covestro TPU. "We are working closely with leading local ODM manufacturers to address emerging material requirements for high-performance laptops. The Desmopan® XHR series has demonstrated significant improvements in component durability and reliability, while we continue to validate innovative structural designs that will expand possibilities for the industry."
Expanding Application Boundaries
Wide-area IoT deployment requires higher environmental adaptability of devices. Covestro's Desmopan® IT series, with superior overmolding capabilities, enables innovative design solutions for smart Wi-Fi router. When integrated with PC/ABS materials in router panels and base plate it enhances tactile experience and vibration dampening while ensuring long-term stability through UV resistance and low migration properties.
In the robotics sector, the rising cleaning robots demand sophisticated component performance. The Desmopan® IT series TPU, engineered with enhanced hydrolysis resistance, slip resistance, and tear strength, ensures reliable performance for high-frequency use components like wheels and cleaning brushes. For wearables, specialized soft-grade TPU formulations balance comfort with chemical resistance and antimicrobial properties.
"Covestro is actively advancing sustainability initiatives," states Kevin Ho, Head of Sales and Market Development APAC of Covestro TPU. "Through bio-based materials, mass balance approach, and recycling systems, our Desmopan® CQ series achieves up to 80% sustainable content. Our bio-based TPU solutions, now commercially adopted by leading global laptop manufacturers, contribute to carbon footprint reduction goals. As a PFAS-free recyclable material, TPU single-material solution simplifies product recycling processes, pioneering industry sustainability."
Innovative Materials Shape Future Design
Covestro's TPU APAC R&D center and production site in Taichung provides rapid technical support for the region. TPU's excellent surface finish replication enables direct molding of various textures from high-gloss to textile-like effects. "Combined with TPU foaming technology and innovations in TPU fibers and synthetic leather, these materials enhance product functionality and aesthetics. Through collaboration with value chain partners and commitment to sustainable innovation, Covestro is advancing TPU solutions to help brands reimagine smart device design for the AI era.