Saxon international internship Program (SiiP)

Internship Title: Technical Strategy & Application Engineering Intern -Key Focus: Semiconductor Automation @ Beckhoff Taiwan

Internship Start and Duration: August 1st 2026, Duration: 5 months

Internship Location: Taichung

Tasks/ Responsibilities: The intern will work at the intersection of Application Engineering and Technical Strategy, with a primary focus on semiconductor equipment automation in Taiwan. 

1. Engineering Focus (~70%): Semiconductor Equipment Automation Analysis 

• (1) System Analysis: Study control architectures for semiconductor equipments (motion control system, EtherCAT, and PC-based control). 
• (2) Requirements Mapping: Evaluate how Beckhoff’s platform (TwinCAT/IPC) addresses needs in Lithography, Etching, and Advanced Packaging. 
• (3) Solution Design: Support the development of conceptual control system architectures, including system topologies and block diagrams. 
• (4) Benchmarking: Conduct technical comparisons against competitor platforms (e.g., Keyence, Mitsubishi, Omron) regarding performance and scalability.
   

2. Strategy Focus (~30%): Market Alignment 

• (1) Insight Integration: Translate technical findings from the Taiwan ecosystem into structured reports. 
• (2) Strategic Support: Assist in identifying market opportunities and preparing technical presentations for communication with Headquarters in Germany. 
• (3) Final Project: Deliver a comprehensive report/presentation combining engineering analysis with strategic recommendations for the Taiwan market.

Learning Possibilities: This internship offers a rare blend of advanced engineering and strategic positioning within the global semiconductor hub. You will gain experience in: 

• 1. Advanced Automation Engineering: Master PC-based control (TwinCAT), real-time communication (EtherCAT), and high-precision multi-axis motion control. 
• 2. Semiconductor Domain Knowledge: Gain deep insights into front-end/back-end processes and the integration challenges of next-gen semiconductor tools. 
• 3. System Design & Benchmarking: Learn to evaluate automation platforms and translate complex equipment requirements into scalable control architectures. 
• 4. Global Business Strategy: Develop professional skills in international B2B collaboration, working directly with engineering teams in Germany and the Taiwan ecosystem. 
• Career Path: This role prepares you for future excellence in System Architecture, Product Management, or Technical Strategy within advanced manufacturing industries.
   

Applicant Profile - Field of Study: Automation Control, Electrical Engineering, Mechanical Engineering, or Computer Science (or a related field)

Applicant Profile – Education Level: Master/Graduate Studies

Applicant Profile - Language Skills: English: Minimum CEFR Level B2 required；Chinese (Mandarin): Conversational proficiency required

Applicant Profile - Software Skills: Knowledgeable in PLC programming and programming languages including C#, C++, and Python.Beckhoff Automation Co., Ltd

Internship Title: Robert Bosch Engineering Internship MEMS Semiconductor Package Development

Internship Start and Duration: Starting point if flexible based on candidate availability. Preferred min. duration is 3 months.

Internship Location: Taipei/New Taipei

Tasks/ Responsibilities:

• Support R&D tasks in semiconductor package development
• Create Database with known MEMS package design rule capabilities
• Participate in MEMS packaging pre-development activities
• Create and roll out AI-based solutions for automated analysis of in-process quality control datasets

Learning Possibilities: Semiconductor supply chain management, supplier coordination, semiconductor package design and assembly process development, statistical process control, quality processes and tools, sensor development, reliability testing, ...

Applicant Profile - Field of Study: Engineering Material Sciences Natural Sciences, existing knowledge about semiconductor devices preferred Master/Graduate Studies

Applicant Profile - Language Skills: Strong technical English fluency. Ability to discuss engineering topics with precision. Documentation ability to write technical reports in English. Verbal Communication Capable of leading technical presentations in English. Conversational German and/or Chinese is a bonus.

Applicant Profile – Education Level: Master/Graduate Studies

Applicant Profile - Software Skills: Experience with big data analysis / machine learning software / CAD systems is a bonus.

Applicant Profile - Additional Skills: Curiosity, self-motivation, perseverance, analytical thinking, and confident communication

Internship Title: Sales, Marketing and Operations Internship at Infineon Technologies Taiwan

Internship Start and Duration: Aug 1, 2026 onwards. 3-4 months

Internship Location: Taipei/New Taipei​

Tasks/ Responsibilities: Work with Sales, Marketing and Operation teams to learn about Semiconductor industry knowledge and how does the supply chain, eco-system work

Learning Possibilities: Work with Sales, Marketing and Operation teams to learn about Semiconductor industry knowledge and how does the supply chain, eco-system work

Applicant Profile - Field of Study: Technical background is a plus but not a must​

Applicant Profile - Language Skills: Good command of English is enough

Applicant Profile – Education Level: Master/Graduate Studies / Bachelor/Undergraduate Studies (3rd year and above)

Applicant Profile - Software Skills: N/A

Applicant Profile - Additional Skills: N/A